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BGA Reballing Stencil for DDR6 BGA180 Tin Planting Steel Mesh IC Solder Template
– For those who need to reball DDR6 BGA180 IC
– Features precise alignment and evenly distributed solder paste
– Durable steel mesh construction ensures longevity
– Available in various sizes and options to meet specific needs
– Additional features include anti-static and heat-resistant properties
₹2,428
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- PAN India shipping
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- Order cancellation window 24 hrs
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