CX H1300 Thermal Non-Conductive Putty Silicone Heat Sink Compound 13.5W/MK

Product Description: CX H1300 Thermal Non-Conductive Putty Silicone Heat Sink Compound is a highly efficient thermal interface material designed to enhance heat dissipation between electronic components and heat sinks. With a thermal conductivity of 13.5W/mK, it effectively transfers heat away from sensitive components, preventing overheating and ensuring optimal performance.

Product Features:

• Exceptional Thermal Conductivity: 13.5W/mK for superior heat dissipation.
• Electrical Insulation: Non-conductive formula prevents electrical shorts.
• Wide Operating Temperature Range: -40°C to 200°C (-40°F to 392°F) for reliable performance in extreme conditions.
• Versatile and Easy to Apply: Putty-like consistency allows for easy application between any surface, even irregular shapes.
• Long-Lasting Stability: Maintains its properties over time, ensuring consistent heat transfer.

Key Usage Points:

• Improve heat dissipation in electronic devices, such as CPUs, GPUs, and power transistors.
• Enhance heat transfer between heat sinks and electronic components.
• Fill gaps and irregular surfaces to optimize thermal contact.
• Provide electrical insulation to prevent short circuits.

Additional Features:

• Color Options: Available in white or gray to complement your device’s aesthetic.
• Durable and Reliable: Designed for extended use in demanding applications.
• Non-Toxic and Environmentally Friendly: Meets RoHS and REACH compliance standards.
• Bulk Quantities: Available in various sizes to meet your project requirements.

For more information on CX H1300 Thermal Non-Conductive Putty Silicone Heat Sink Compound, please refer to the following resources:

CX-Products Thermal Putties

Understanding Thermal Interface Materials

Thermal Conductivity Converter