Thin Heat Sink Back Memory Card HeatSink Cooling Pad For MOS

Product Features:

• Fit for the back of memory card of electronic device.
• With thermal conductive adhesive tape, easy installation
• Durable
• Color: As shown

Product Description:

The heat sink is made of high-quality aluminum alloy, which has good thermal conductivity, heat dissipation and oxidation resistance. The surface is anodized, which is beautiful and wear-resistant. The heat sink is designed to increase the heat dissipation area of the memory card, so it can reduce the temperature of the memory card and improve its working stability. The heat sink is suitable for various electronic devices, such as mobile phones, tablets, laptops, etc.

How to use:

1) Clean the back of the memory card with an alcohol swab.
2) Remove the protective film from the thermal conductive adhesive tape.
3) Stick the heat sink to the back of the memory card.
4) Press the heat sink firmly for a few seconds.

Note:

The size of the heat sink may not be exactly the same as the back of the memory card. However, it does not affect the use of the heat sink.