Thermal Pad,Non-Conductive GPU Card Water Cooling Thermal Mat 17.3W/mk 100x100mm
This thermal pad is made of high-quality silicone material, which is soft, flexible, and has excellent thermal conductivity. It is used to fill the gap between the heat source and the heat sink, thereby improving heat dissipation and reducing the temperature of the heat source.
Its features are as follows:
– High thermal conductivity: 17.3W/mk
– Soft and flexible: Easy to install and fit to uneven surfaces.
– Non-conductive: Safe to use on electrical components.
– Wide temperature range: -40°C to 200°C
– Available in various sizes and thicknesses to meet different needs.
Product Features:
- Effective Heat Dissipation: With a thermal conductivity of 17.3W/mk, this thermal pad efficiently transfers heat away from heat-generating components.
- Wide Compatibility: Compatible with various heat sinks, graphics cards, memory modules, and power transistors, ensuring a snug fit and optimal heat transfer.
- Excellent Flexibility: Its pliable nature allows for easy application, conforming to uneven surfaces for maximum contact and heat dissipation.
- Non-Conductive Design: Provides electrical insulation, preventing short circuits and ensuring safe operation.
- Versatile Application: Suitable for a range of electronic devices and industrial applications where heat management is crucial.
- Durability and Reliability: Constructed from high-quality silicone material, this thermal pad exhibits excellent durability, ensuring long-lasting performance.
- Easy Installation: Self-adhesive backing simplifies installation, allowing for quick and convenient application.
- Multiple Size Options: Available in various sizes to accommodate different component dimensions, ensuring a tailored fit for optimal heat dissipation.
- Temperature Resistance: Withstands a wide temperature range of -40°C to 200°C, making it suitable for demanding environments.
Benefits:
- Improved Heat Dissipation: Keeps components cool, preventing overheating and potential damage.
- Enhanced System Performance: Ensures stable operation and prevents performance degradation due to excessive heat.
- Extended Component Lifespan: Reduces wear and tear on heat-generating components, prolonging their lifespan.
- Safe and Reliable Operation: Non-conductive design eliminates electrical hazards, ensuring safe usage.
- Easy Installation and Maintenance: Self-adhesive backing and flexible nature facilitate hassle-free installation and maintenance.
Usage:
Filling the gap between heat sinks and heat-generating components in electronic devices.
Improving heat dissipation in power supplies, voltage regulators, and other industrial applications.
Enhancing thermal conductivity in LED lighting systems.
Providing insulation and heat transfer in telecommunications equipment.
For more information on thermal pad applications, refer to the following resources:
Thermal Interface Materials: Importance, Selection, and Application
Thermal Interface Materials: An Overview