Thermal Pad Non Conductive Silicone Grease Pad Heat Dissipation Multi-Size

Product Features:

– Excellent thermal conductivity, high reliability, and low thermal resistance;
– Non-toxic, odorless, non-corrosive, non-flammable, and non-explosive;
– Good electrical insulation performance;
– Good adhesion, easy installation, and good flexibility;
– Wide application range, can be used in various electronic components;

**Suitable for:**

– Power semiconductor modules, transistors, thyristors, diodes, etc.;
– CPU, GPU, VGA card, memory, and other electronic components;
– Heat sinks, chassis, and other heat dissipation devices;
– Filling the gap between heat sources and heat sinks to achieve better heat dissipation effects;

**Features:**

– Thermal conductivity: >2.0 W/mK;
– Temperature range: -40°C~220°C;
– Thickness: 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm;
– Size: 100mm*100mm, 200mm*200mm, 300mm*300mm;

**Benefits:**

– Effectively reduce the temperature of electronic components and extend their service life;
– Improve the stability and reliability of electronic devices;
– Prevent electronic components from overheating and causing damage;
– Reduce energy consumption and improve overall system efficiency;
– Easy to install and remove, convenient to maintain and replace;

**Tips:**

– Please clean the surface of the heat source and heat sink before installation;
– Cut the thermal pad to the appropriate size according to the actual needs;
– Ensure that the thermal pad is fully in contact with the heat source and heat sink;
– If the thickness of the thermal pad is too large, it may affect the heat dissipation effect;