Thermal Pad 17.3 for W/mK Non Conductive Heat Dissipation Silicone Pad for PC

Product Features:
– Utilizes high-performance silicone material, non-toxic, harmless, and environmentally friendly.
– A thermal conductivity of 17.3 W/mK, providing efficient heat dissipation.
– Features a non-conductive design, ensuring electrical insulation and preventing the risk of short circuits.
– Exhibits excellent heat resistance, withstanding temperatures ranging from -40℃ to 200℃.
– Boasts strong conformability and flexibility, allowing for easy installation and fitting on uneven surfaces.
– Available in various sizes to meet the specific requirements of different applications.

Benefits:
– Effectively dissipates heat from electronic components, preventing overheating and ensuring optimal performance.
– Its non-conductive nature prevents electrical hazards, enhancing safety and reliability.
– Provides long-lasting durability due to its excellent heat resistance, ensuring uninterrupted operation.
– Facilitates efficient heat transfer due to its high thermal conductivity, improving the performance of electronic devices.
– Simple installation process thanks to its conformability and flexibility, saving time and effort.
– Wide range of applications, including laptops, desktops, servers, and other electronic devices.

Additional Features:
– RoHS and REACH compliant, ensuring adherence to environmental regulations.
– Available in tailored sizes and shapes to accommodate specific design requirements.
– Supports bulk orders for large-scale applications.

Applications:
– Heat dissipation for CPUs, GPUs, and other heat-generating components in electronic devices.
– Thermal interface material for connecting heat sinks and coolers to electronic components.
– Providing electrical insulation between heat sources and other electronic components.

Specifications:
– Thermal Conductivity: 17.3 W/mK
– Temperature Range: -40℃ to 200℃
– Material: Silicone
– Non-Conductive: Yes
– RoHS and REACH Compliant: Yes

External Links:
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