Thermal Grease Paste Compound Silicon CPU GPU Heatsink Processor Cooling

Product Features:

• Thermal Conductivity: 3.0 W/mK
• Thermal Resistance: <0.033 °C-in²/W
• Specific Gravity: 2.3
• Viscosity: 16000-28000 mPa.s
• Operating Temperature Range: -30 to 200 °C

Benefits:

• Effectively transfer heat from high-output power electronic components to dissipate heat sinks.
• Prevents hot spots and thermal runaway, prolonging CPU, GPU, and other electronic components’ lifespan
• Compatible with all types of CPUs, GPUs, heatsinks, and cooling systems

Key Usage Points:

• Easy Installation: Syringe applicator for precise and mess-free application
• Durability: High thermal conductivity, non-toxic, non-corrosive, and non-curing
• Color Options: Available in gray or white to match system aesthetics

Specifications:

Additional Features:

• Higher Performance: Superior thermal conductivity ensures maximum heat dissipation and cooling efficiency.
• Reliable: Non-capacitive and low bleed, resulting in stable performance over time.
• Versatile: Suitable for various applications, including CPUs, GPUs, LED lighting, and industrial electronics.

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