Thermal Compound Conductive Grease Silicone Heat Sink Processor CPU GPU

This thermal compound conductive grease is a high-performance thermal interface material that is designed to maximize heat transfer between two surfaces. It is composed of a silicone-based grease that is filled with thermally conductive fillers. Any trapped air between the heat sink and CPU will lead to poor thermal transfer and eventually overheating, which can lead to system instability or even damage. A quality thermal compound will fill in microscopic gaps and efficiently transfer heat from the CPU (or other heat-generating component) to the heatsink. The Thermal Compound Conductive Grease Silicone Heat Sink Processor CPU GPU is ideal for use in high-power applications, such as CPUs, GPUs, and power transistors. It is also suitable for use in applications where a low thermal resistance is required, such as in heat sinks and other cooling devices.

Product Features:

* High thermal conductivity
* Low thermal resistance
* Easy to apply
* Non-toxic and non-corrosive
* Stable over a wide temperature range

Benefits:

* Improves heat transfer efficiency
* Reduces component temperatures
* Extends component life
* Prevents system instability and damage

Applications:

* CPUs
* GPUs
* Power transistors
* Heat sinks
* Other cooling devices

Instructions for Use:

1. Clean the surfaces of the heat sink and the component to be cooled.
2. Apply a thin layer of thermal compound to the surface of the component.
3. Install the heat sink and tighten the screws.
4. Allow the thermal compound to cure for 24 hours before operating the system.

Caution:

* Do not apply excessive thermal compound.
* Do not use thermal compound on surfaces that are not clean.
* Keep thermal compound away from children.

Technical Specifications:

* Thermal conductivity: 4.5 W/m-K
* Thermal resistance: 200°C
* Operating temperature range: -50°C to +200°C