SRLG4 BGA Balls Reball Stencil Direct Heat Tin Planting Table Platform GPU

Product Features: - The SRLG4 BGA Balls Reball Stencil is a high-precision solder ball stenciling tool designed for reballing BGA (Ball Grid Array) components. - It is made of durable stainless steel for long-lasting use. - The stencil features precise cutouts that align perfectly with the BGA pads, ensuring accurate solder ball placement. - The included direct heat tin planting table platform allows for easy and efficient solder ball planting. - It eliminates the risk of shorts and bridges during the reballing process. - The stencil is compatible with a wide range of BGA sizes and pitches, making it a versatile tool for various repair applications. Benefits: - Precise and accurate solder ball placement for optimal BGA component performance. - Durable stainless steel construction ensures longevity and reliability. - Easy installation and operation, saving time and effort during reballing. - Prevents short circuits and bridges, ensuring the reliability of repaired components. - Compatible with a wide range of BGA sizes and pitches, offering versatility for various repair needs. Key Usage Points: - Reballing BGA components for repair or rework. - High-volume solder ball planting for production and assembly. - Precision alignment and placement for critical applications. - Durable and reliable for long-term use. - Compatible with standard BGA stenciling equipment.

SRLG4 BGA Balls Reball Stencil Datasheet

How to Use SRLG4 BGA Balls Reball Stencil (Video Tutorial)