SRLG4 BGA Balls Reball Stencil Direct Heat Tin Planting Table Platform GPU

Product Features:

– The SRLG4 BGA Balls Reball Stencil is a high-precision solder ball stenciling tool designed for reballing BGA (Ball Grid Array) components.
– It is made of durable stainless steel for long-lasting use.
– The stencil features precise cutouts that align perfectly with the BGA pads, ensuring accurate solder ball placement.
– The included direct heat tin planting table platform allows for easy and efficient solder ball planting.
– It eliminates the risk of shorts and bridges during the reballing process.
– The stencil is compatible with a wide range of BGA sizes and pitches, making it a versatile tool for various repair applications.

Benefits:

– Precise and accurate solder ball placement for optimal BGA component performance.
– Durable stainless steel construction ensures longevity and reliability.
– Easy installation and operation, saving time and effort during reballing.
– Prevents short circuits and bridges, ensuring the reliability of repaired components.
– Compatible with a wide range of BGA sizes and pitches, offering versatility for various repair needs.

Key Usage Points:

– Reballing BGA components for repair or rework.
– High-volume solder ball planting for production and assembly.
– Precision alignment and placement for critical applications.
– Durable and reliable for long-term use.
– Compatible with standard BGA stenciling equipment.