Silicone Thermal Compound 4.0W Conductive For CPU GPU Chipset Notebook PC
Product Features:
– Ultra High Thermal Conductivity: 4.0 W/ m-K
– Low Thermal Resistance: <0.050 °C-in²/W
– Wide Operating Temperature Range: -58°F to 392°F (-50°C to 200°C)
– Excellent Pump-out Resistance
– Easy Application and Clean-up
– RoHS Compliant
The Silicone Thermal Compound 4.0W is a high-performance thermal compound designed to maximize heat transfer between electronic components and heat sinks. It is ideal for use in laptops, desktops, servers, and other electronic devices.
The thermal compound is made of a silicone-based material that is highly conductive to heat. It has a thermal conductivity of 4.0 W/ m-K, which is significantly higher than that of traditional thermal pastes. This high thermal conductivity ensures that heat is transferred quickly and efficiently from the electronic component to the heat sink, preventing the component from overheating.
In addition to its high thermal conductivity, the Silicone Thermal Compound 4.0W also has a low thermal resistance of <0.050 °C-in²/W. This low thermal resistance means that there is minimal resistance to heat flow, which further improves the heat transfer efficiency.
The thermal compound has a wide operating temperature range of -58°F to 392°F (-50°C to 200°C). This makes it suitable for use in a variety of applications, including extreme temperature environments.
The thermal compound is also pump-out resistant, which means that it will not be squeezed out from between the electronic component and the heat sink under high pressure. This ensures that the thermal compound remains in place and continues to perform effectively over time.
The Silicone Thermal Compound 4.0W is easy to apply and clean-up. It is non-toxic and non-corrosive, making it safe to use on electronic components.
The Silicone Thermal Compound 4.0W is RoHS compliant, meaning that it does not contain any hazardous substances.
Benefits:
– Improves heat transfer efficiency
– Prevents electronic components from overheating
– Extends the life of electronic components
– Reduces noise and vibration
– Easy to apply and clean-up
Usage:
– The Silicone Thermal Compound 4.0W can be used on a variety of electronic components, including CPUs, GPUs, chipsets, and notebooks.
– It is ideal for use in applications where high thermal conductivity and low thermal resistance are required.
Installation:
– The Silicone Thermal Compound 4.0W is easy to install.
– Clean the surface of the electronic component and the heat sink.
– Apply a thin, even layer of thermal compound to the surface of the electronic component.
– Place the heat sink on the electronic component and secure it in place.
Color Options:
– The Silicone Thermal Compound 4.0W is available in a variety of colors, including black, gray, and white.
Detailed Specifications:
– Thermal Conductivity: 4.0 W/ m-K
– Thermal Resistance: <0.050 °C-in²/W
– Operating Temperature Range: -58°F to 392°F (-50°C to 200°C)
– Pump-out Resistance: Yes
– Application and Clean-up: Easy
– RoHS Compliance: Yes
External Links:
– [Manufacturer’s website](https://www.example.com/silicone-thermal-compound-4-0w/)
– [Blog post about thermal compound](https://www.example.com/blog/thermal-compound/)
– [Video tutorial on how to apply thermal compound](https://www.example.com/video/how-to-apply-thermal-compound/)
