Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set for Laptop

Product Features: -Laser cut stencils for precise alignment and placement of BGA components -Reusable and durable, made from high-quality steel -Direct heat set for efficient and reliable soldering -Suitable for a wide range of laptops and other electronic devices -Easy to use, even for beginners -Compact and portable, making it easy to store and transport Benefits: -Improves the accuracy and reliability of BGA reballing -Saves time and effort compared to traditional methods -Reduces the risk of damage to the BGA components or the circuit board -Ensures a secure and long-lasting connection -Compatible with a variety of solder paste and flux types -Can be used for both lead-free and leaded solder Key Usage Points: -BGA reballing -Soldering BGA components -Repairing laptops and other electronic devices -Prototyping and manufacturing Specifications: -Material: Steel -Thickness: 0.12mm -Aperture: 0.15mm -Pitch: 0.5mm -Size: 100mm x 100mm Additional Features: -Comes with a protective case for storage and transportation -Available in a variety of sizes and pitches to meet different application requirements -Compatible with most BGA rework stations -Provides a consistent and repeatable soldering process -Helps to prevent solder bridging and other common soldering defects External Links: -

Video tutorial on how to use BGA reballing stencils

-

iFixit guide to BGA reballing

-

EEVblog forum discussion on BGA reballing