Reballing Rework Net Stencils Steel Template Mesh Directly Heat Set for Laptop
Product Features:
-Laser cut stencils for precise alignment and placement of BGA components
-Reusable and durable, made from high-quality steel
-Direct heat set for efficient and reliable soldering
-Suitable for a wide range of laptops and other electronic devices
-Easy to use, even for beginners
-Compact and portable, making it easy to store and transport
Benefits:
-Improves the accuracy and reliability of BGA reballing
-Saves time and effort compared to traditional methods
-Reduces the risk of damage to the BGA components or the circuit board
-Ensures a secure and long-lasting connection
-Compatible with a variety of solder paste and flux types
-Can be used for both lead-free and leaded solder
Key Usage Points:
-BGA reballing
-Soldering BGA components
-Repairing laptops and other electronic devices
-Prototyping and manufacturing
Specifications:
-Material: Steel
-Thickness: 0.12mm
-Aperture: 0.15mm
-Pitch: 0.5mm
-Size: 100mm x 100mm
Additional Features:
-Comes with a protective case for storage and transportation
-Available in a variety of sizes and pitches to meet different application requirements
-Compatible with most BGA rework stations
-Provides a consistent and repeatable soldering process
-Helps to prevent solder bridging and other common soldering defects
External Links:
–
Video tutorial on how to use BGA reballing stencils
–
iFixit guide to BGA reballing
–
EEVblog forum discussion on BGA reballing
