LGA1700-BCF CPU Fixed Backplane Bending Correction Type Mounting for CPU
The LGA1700-BCF CPU Fixed Backplane Bending Correction Type Mounting for CPU is a premium-grade mounting solution designed to address the bending issues associated with the LGA1700 socket. It effectively corrects backplane bending, ensuring optimal contact between the CPU and socket, leading to improved performance and stability.
Product Features:
– Precision-engineered to fit LGA1700 sockets, providing a secure and stable mounting platform.
– Constructed using high-quality aluminum alloy, offering excellent durability and heat dissipation.
– Utilizes a unique fixed backplane design that prevents bending, ensuring proper CPU contact.
– Comes with pre-installed thermal pads to enhance heat transfer between the CPU and heatsink.
– Simple and hassle-free installation process for quick and easy setup.
Benefits:
– Eliminates backplane bending issues, ensuring a reliable connection between CPU and socket.
– Improves system stability and performance by maintaining optimal contact.
– Reduces thermal throttling by dissipating heat effectively.
– Provides a durable and long-lasting mounting mechanism for your CPU.
– Easy to install, saving time and effort during system assembly.
Key Usage Points:
– Ideal for use in high-performance gaming and workstation systems.
– Suitable for both air and liquid cooling setups.
– Compatible with all LGA1700 motherboards.
– Enhances the life span of your CPU and motherboard by preventing damage.
Specifications:
– Socket Compatibility: LGA1700
– Mounting Type: Fixed Backplane Bending Correction
– Material: Aluminum Alloy
– Dimensions: 70mm x 70mm x 22mm
– Weight: 150 grams
Intel LGA1700 Socket Information
Tom’s Hardware: LGA1700 Socket Mounting Concerns
ASUS ROG: LGA1700 Socket Guide
