HY880 Carbon Thermal Pad

HY880 Carbon Thermal Pad is a high-performance thermal interface material designed to provide excellent heat dissipation between electronic components and heat sinks. It effectively transfers heat away from CPUs, GPUs, chipsets, and other heat-generating components, maximizing cooling efficiency and ensuring optimal system performance. Product Features: * Exceptional Thermal Conductivity: With a thermal conductivity of 8.5 W/mK, HY880 Carbon Thermal Pad efficiently conducts heat away from electronic components, reducing operating temperatures. * Excellent Conformability: The ultra-soft and highly conformable nature of the thermal pad allows it to conform to irregular surface contours, ensuring optimal contact and heat transfer. * Ultra-High Temperature Resistance: The thermal pad is designed to withstand high temperatures, up to 200°C, making it suitable for demanding applications where heat dissipation is crucial. * Low Thermal Impedance: The low thermal impedance of the pad minimizes heat resistance, ensuring efficient heat transfer and reducing the risk of thermal throttling. * Durable and Reliable: HY880 Carbon Thermal Pad is engineered to withstand harsh operating conditions, providing long-lasting performance and durability. Key Usage Points: * High-performance heat dissipation for CPUs, GPUs, chipsets, and other electronic components * Ideal for use in laptops, desktops, gaming consoles, and servers * Ensures optimal thermal performance and prevents overheating * Easy installation, with pre-cut sizes available for convenient application * Available in various thicknesses to meet specific application requirements Additional Features: * Non-conductive, ensuring electrical safety * RoHS compliant, meeting environmental regulations * Packaged in individually sealed bags for freshness and ease of use For more information on product specifications, installation, and application tips:

Thermal-Pad.com: HY880 Carbon Thermal Pad