HY880 Carbon Thermal Pad

HY880 Carbon Thermal Pad is a high-performance thermal interface material designed to provide excellent heat dissipation between electronic components and heat sinks. It effectively transfers heat away from CPUs, GPUs, chipsets, and other heat-generating components, maximizing cooling efficiency and ensuring optimal system performance.

Product Features:

* Exceptional Thermal Conductivity: With a thermal conductivity of 8.5 W/mK, HY880 Carbon Thermal Pad efficiently conducts heat away from electronic components, reducing operating temperatures.
* Excellent Conformability: The ultra-soft and highly conformable nature of the thermal pad allows it to conform to irregular surface contours, ensuring optimal contact and heat transfer.
* Ultra-High Temperature Resistance: The thermal pad is designed to withstand high temperatures, up to 200°C, making it suitable for demanding applications where heat dissipation is crucial.
* Low Thermal Impedance: The low thermal impedance of the pad minimizes heat resistance, ensuring efficient heat transfer and reducing the risk of thermal throttling.
* Durable and Reliable: HY880 Carbon Thermal Pad is engineered to withstand harsh operating conditions, providing long-lasting performance and durability.

Key Usage Points:

* High-performance heat dissipation for CPUs, GPUs, chipsets, and other electronic components
* Ideal for use in laptops, desktops, gaming consoles, and servers
* Ensures optimal thermal performance and prevents overheating
* Easy installation, with pre-cut sizes available for convenient application
* Available in various thicknesses to meet specific application requirements

Additional Features:

* Non-conductive, ensuring electrical safety
* RoHS compliant, meeting environmental regulations
* Packaged in individually sealed bags for freshness and ease of use

For more information on product specifications, installation, and application tips: