HY710 Thermal Conductivity Grease Silicone Heat Sink Compound 3.17W/M-K

Product Features:

– High Thermal Conductivity: 3.17W/m-K, ensures efficient heat dissipation from CPUs and other electronic components.
– Stable Performance: Maintains consistent thermal conductivity over a wide temperature range (-50°C to 200°C) for reliable performance.
– Excellent Insulation: Electrical insulation properties prevent short circuits and ensure safe operation of electronic devices.
– Non-Toxic and Safe: Silicone-based formula is non-toxic, non-corrosive, and environmentally friendly for peace of mind.
– Easy Application: Smooth, paste-like texture allows for easy and mess-free application between heat sinks and components.

HY710 Thermal Conductivity Grease is formulated with high-purity silicone materials to provide exceptional thermal conductivity, ensuring efficient heat dissipation from high-performance electronic components. Its stable performance over a wide temperature range makes it suitable for various applications, including CPUs, GPUs, power modules, and LED lighting. The non-toxic, non-corrosive formula guarantees safety and reliability, while its easy application simplifies installation and maintenance.

Benefits:

– Enhanced heat dissipation for improved system stability
– Reduced operating temperatures for longer component lifespan
– Improved electrical insulation for increased device safety
– Hassle-free installation and maintenance

Key Usage Points:

– Filling air gaps between heat-generating components and heat sinks
– Improving heat transfer in electronic devices for enhanced performance
– Preventing thermal damage and performance degradation in high-power applications

Specifications:

– Thermal Conductivity: 3.17W/m-K
– Operating Temperature Range: -50°C to 200°C
– Density: 2.5g/cm³
– Viscosity: 100,000-150,000mPa·s
– Volume: 50g

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