HY710 Thermal Conductivity Grease Silicone Heat Sink Compound 3.17W/M-K

Product Features: - High Thermal Conductivity: 3.17W/m-K, ensures efficient heat dissipation from CPUs and other electronic components. - Stable Performance: Maintains consistent thermal conductivity over a wide temperature range (-50°C to 200°C) for reliable performance. - Excellent Insulation: Electrical insulation properties prevent short circuits and ensure safe operation of electronic devices. - Non-Toxic and Safe: Silicone-based formula is non-toxic, non-corrosive, and environmentally friendly for peace of mind. - Easy Application: Smooth, paste-like texture allows for easy and mess-free application between heat sinks and components. HY710 Thermal Conductivity Grease is formulated with high-purity silicone materials to provide exceptional thermal conductivity, ensuring efficient heat dissipation from high-performance electronic components. Its stable performance over a wide temperature range makes it suitable for various applications, including CPUs, GPUs, power modules, and LED lighting. The non-toxic, non-corrosive formula guarantees safety and reliability, while its easy application simplifies installation and maintenance. Benefits: - Enhanced heat dissipation for improved system stability - Reduced operating temperatures for longer component lifespan - Improved electrical insulation for increased device safety - Hassle-free installation and maintenance Key Usage Points: - Filling air gaps between heat-generating components and heat sinks - Improving heat transfer in electronic devices for enhanced performance - Preventing thermal damage and performance degradation in high-power applications Specifications: - Thermal Conductivity: 3.17W/m-K - Operating Temperature Range: -50°C to 200°C - Density: 2.5g/cm³ - Viscosity: 100,000-150,000mPa·s - Volume: 50g Disclaimer:

Manufacturer's website for HY710 thermal grease

Puget Systems article on thermal compound performance

Tom's Hardware guide to choosing the right thermal paste