HY510 Gray Thermal Silicone Heat Sink Compound 1.93W/for m.K for Processor

Product Features:

• HY510 Gray Thermal Silicone Heat Sink Compound is a non-toxic, non-corrosive, and non-flammable silicone grease that offers high thermal conductivity.
• It is used for filling the air gap between the contact surfaces of electronic devices and heat sinks to improve heat dissipation.
• It is easy to apply and can be used for a wide range of applications, including CPU, GPU, LED, and power modules.
• The thermal conductivity of this heat sink compound is 1.93W/for m.K, which is much higher than that of air.
• Additionally, this compound can also reduce noise and vibration, and prevent dust buildup.

Key Usage Points:

• Easy installation
• Durability
• Color options

Detailed Specifications:

• Thermal conductivity: 1.93W/for m.K
• Viscosity: 100,000-150,000 mPa·s
• Operating temperature: -50℃ to 200℃
• Storage temperature: -20℃ to 25℃
• Package size: 5g/10g/20g/50g/100g/200g per tube
• HY510 Thermal Silicone Heat Sink Compound

Additional Features:

• This heat sink compound is RoHS compliant
• It is also UL94 V-0 flame retardant

Benefits:

• Improves heat dissipation
• Extends the lifespan of electronic devices
• Reduces noise and vibration
• Prevents dust buildup

This heat sink compound is a reliable and cost-effective solution for improving the thermal performance of electronic devices. It is easy to apply, durable, and RoHS compliant.