High-Performance HY510 Gray Thermal Silicone Heat Sink Compound for Improved Heat Transfer (1.93W/m·K) for Processors

ID: 817302 SKU: 394946879452 Category: Computer and laptop accessories Tags: 30days

High-Performance HY510 Gray Thermal Silicone Heat Sink Compound for Improved Heat Transfer (1.93W/m·K) for Processors

About this item:

– Thermal paste helps dissipate heat from your processor to the heat sink – The high thermal conductivity of 1.93 W/m-K ensures efficient heat dissipation – It has excellent long-term stability at high temperatures – Easy to apply, non-toxic and non-corrosive

₹1590

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Description ▼

HY510 Gray Thermal Silicone Heat Sink Compound 1.93W/for m.K for Processor

Product Features:

HY510 Gray Thermal Silicone Heat Sink Compound is a non-toxic, non-corrosive, and non-flammable silicone grease that offers high thermal conductivity.
It is used for filling the air gap between the contact surfaces of electronic devices and heat sinks to improve heat dissipation.
It is easy to apply and can be used for a wide range of applications, including CPU, GPU, LED, and power modules.
The thermal conductivity of this heat sink compound is 1.93W/for m.K, which is much higher than that of air.
Additionally, this compound can also reduce noise and vibration, and prevent dust buildup.

Key Usage Points:

Easy installation
Durability
Color options

Detailed Specifications:

Thermal conductivity: 1.93W/for m.K
Viscosity: 100,000-150,000 mPa·s
Operating temperature: -50℃ to 200℃
Storage temperature: -20℃ to 25℃
Package size: 5g/10g/20g/50g/100g/200g per tube
HY510 Thermal Silicone Heat Sink Compound

Additional Features:

This heat sink compound is RoHS compliant
It is also UL94 V-0 flame retardant

Benefits:

Improves heat dissipation
Extends the lifespan of electronic devices
Reduces noise and vibration
Prevents dust buildup

This heat sink compound is a reliable and cost-effective solution for improving the thermal performance of electronic devices. It is easy to apply, durable, and RoHS compliant.