HY410-CN10 Silicone Compound Thermal Paste Conductive Grease CPU GPU Heatsink

The HY410-CN10 Silicone Compound Thermal Paste is a high-performance, silicone-based thermal paste that is designed to enhance heat transfer between electronic components and heat sinks. It is ideal for use in a wide range of applications, including:

• CPU cooling
• GPU cooling
• Heatsink cooling
• Other electronic components that generate heat

Product Features:

• Excellent thermal conductivity: The HY410-CN10 Thermal Paste has a thermal conductivity of 1.5 W/m-K, which allows it to effectively transfer heat away from electronic components to heat sinks.
• Wide operating temperature range: The HY410-CN10 Thermal Paste can operate in a wide temperature range of -50°C to 200°C, making it suitable for use in demanding applications.
• Easy to apply: The HY410-CN10 Thermal Paste is easy to apply and can be easily spread to ensure good contact between electronic components and heat sinks.
• Non-toxic and environmentally friendly: The HY410-CN10 Thermal Paste is non-toxic and environmentally friendly, making it safe for use in a variety of applications.

Benefits of Using the HY410-CN10 Thermal Paste:

• Improved heat transfer between electronic components and heat sinks
• Reduced operating temperatures of electronic components
• Increased reliability and lifespan of electronic components
• Reduced noise levels from electronic components

Technical Specifications:

Parameter	Value
Thermal conductivity	1.5 W/m-K
Operating temperature range	-50°C to 200°C
Density	2.6 g/cm³
Viscosity	1,000,000 cP

For more information about the HY410-CN10 Silicone Compound Thermal Paste, please visit the following links:

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