HY410-CN10 Silicone Compound Thermal Paste Conductive Grease CPU GPU Heatsink
The HY410-CN10 Silicone Compound Thermal Paste is a high-performance, silicone-based thermal paste that is designed to enhance heat transfer between electronic components and heat sinks. It is ideal for use in a wide range of applications, including:
- CPU cooling
- GPU cooling
- Heatsink cooling
- Other electronic components that generate heat
Product Features:
- Excellent thermal conductivity: The HY410-CN10 Thermal Paste has a thermal conductivity of 1.5 W/m-K, which allows it to effectively transfer heat away from electronic components to heat sinks.
- Wide operating temperature range: The HY410-CN10 Thermal Paste can operate in a wide temperature range of -50°C to 200°C, making it suitable for use in demanding applications.
- Easy to apply: The HY410-CN10 Thermal Paste is easy to apply and can be easily spread to ensure good contact between electronic components and heat sinks.
- Non-toxic and environmentally friendly: The HY410-CN10 Thermal Paste is non-toxic and environmentally friendly, making it safe for use in a variety of applications.
Benefits of Using the HY410-CN10 Thermal Paste:
- Improved heat transfer between electronic components and heat sinks
- Reduced operating temperatures of electronic components
- Increased reliability and lifespan of electronic components
- Reduced noise levels from electronic components
Technical Specifications:
| Parameter |
Value |
| Thermal conductivity |
1.5 W/m-K |
| Operating temperature range |
-50°C to 200°C |
| Density |
2.6 g/cm³ |
| Viscosity |
1,000,000 cP |
For more information about the HY410-CN10 Silicone Compound Thermal Paste, please visit the following links:
Cooler Master MasterGel Pro V2 Thermal Paste
ARCTIC MX-4 Thermal Paste
Thermaltake TG-C3000 Thermal Paste
