HY234 Silicone Grease Thermal Paste for CPU Chipset Heat Sink Cooling Compound

Product Features:

The HY234 is a high-performance thermal paste designed to improve heat transfer between CPUs, GPUs, and heat sinks. It effectively reduces operating temperatures, ensuring optimal system performance and stability.

– Exceptional Thermal Conductivity: With a thermal conductivity of 4.8 W/m·K, the HY234 efficiently transfers heat away from critical components, preventing overheating and performance throttling.
– Easy Application: The non-curing formula allows for effortless application without the need for specialized tools or experience.
– Non-Toxic and Environmentally Friendly: The HY234 is composed of non-toxic and RoHS-compliant materials, ensuring safe handling and disposal.
– Wide Compatibility: Suitable for use with all types of CPUs, GPUs, heat sinks, and other cooling devices.
– Long-Lasting Performance: Maintains stability and effectiveness over extended periods of time, ensuring consistent thermal transfer and system reliability.

Benefits:

– Reduced Operating Temperatures: Improved heat dissipation keeps components cool, preventing thermal throttling and system instability.
– Enhanced System Performance: By removing heat from critical components, the HY234 enables higher clock speeds and improved overall system performance.
– Extended Component Lifespan: Reduced operating temperatures minimize component degradation, extending the lifespan of CPUs, GPUs, and other hardware.
– Quiet Operation: Preventative heat dissipation lowers fan speeds, resulting in a quieter operating system.
– Peace of Mind: Safe and environmentally friendly formula gives users peace of mind during application and disposal.

Specifications:

– Thermal Conductivity: 4.8 W/m·K
– Density: 2.6 g/cm³
– Viscosity: 1,000-1,500 mPa·s
– Operating Temperature: -50°C to 200°C

Additional Features:

– Color: Pink
– Volume: 10g
– Includes: Spatula for easy application

User Concerns and Desires:

The HY234 addresses common user concerns by providing:

– Effective Heat Dissipation: Eliminates overheating and performance issues.
– Easy Installation: Quick and convenient application process.
– Long-Term Reliability: Ensures consistent thermal performance over time.
– Safe and Environmentally Friendly: Protects both users and the environment.

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