HY-P13 Thermal Grease Compound Silicon CPU GPU Heatsink Processor Cooling

Product Description:

HY-P13 is a high-performance thermal grease compound designed to maximize heat transfer between electronic components and heat sinks. Its superior thermal conductivity ensures efficient dissipation of heat, preventing overheating and maintaining optimal operating temperatures for your devices.

Product Features:

* **Exceptional Thermal Conductivity:** Minimizes thermal resistance and effectively transfers heat away from critical components.
* **Non-Electrically Conductive:** Ensures safety and prevents short circuits, making it suitable for use in sensitive electronic applications.
* **Durable and Long-Lasting:** Maintains its thermal performance over extended periods, providing reliable cooling throughout the lifespan of your devices.
* **Easy to Apply:** Smooth consistency facilitates hassle-free application, minimizing mess and ensuring proper coverage.
* **Wide Temperature Range:** Remains effective under various operating temperatures, ensuring optimal performance in demanding environments.

Key Usage Points:

* Ideal for cooling CPUs, GPUs, and other electronic components that generate significant heat.
* Enhances heat dissipation in heat sinks, coolers, and other cooling solutions.
* Suitable for use in laptops, desktops, servers, and other electronic devices.

Additional Features:

* **Non-Toxic and Non-Corrosive:** Safe for use on delicate electronic components without causing damage.
* **Prevents Air Pockets:** Fills gaps between heat-generating surfaces and cooling devices, maximizing heat transfer.
* **Versatile Applications:** Can be used in both industrial and consumer electronics, including gaming PCs, workstations, and home appliances.

Detailed Specifications:

* Thermal Conductivity: 13 W/mK
* Specific Gravity: 2.6g/cm³
* Viscosity: 150,000cps
* Operating Temperature Range: -50°C to 250°C
* Net Weight: 1.5g

For more information on the HY-P13 Thermal Grease Compound, please refer to the following resources:

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