HY-P13 Thermal Grease 13.4W / m-K for for CPU Heatsink

Superior Thermal Conductivity HY-P13 thermal grease boasts a remarkable thermal conductivity of 13.4W/m-K, effectively transferring heat away from delicate components. Its high efficiency enables optimal heat dissipation, preventing overheating and ensuring the longevity and stability of your system. Enhanced Heat Dissipation Specifically formulated for use in CPU heatsinks, HY-P13 forms a high-performance thermal interface between the CPU and the heatsink. The improved heat transfer helps maintain optimal operating temperatures, reducing the risk of thermal throttling and ensuring maximum performance even under demanding workloads. Versatile Applications HY-P13 is a versatile thermal solution designed for a wide range of applications. It is ideal for air-cooled and liquid-cooled CPU systems, ensuring efficient heat transfer and optimal cooling performance in desktops, laptops, and gaming consoles. Easy Application and Long Shelf Life Applying HY-P13 is a breeze, thanks to its user-friendly syringe design. The included spatula further simplifies the process, enabling precise spreading and maximizing heat transfer effectiveness. Additionally, HY-P13 boasts an extended shelf life, providing peace of mind and ensuring optimal performance for extended periods.

Video Tutorial Specifications:

• Thermal Conductivity: 13.4W/m-K
• Specific Gravity: 2.5g/cm3
• Viscosity: 150000mPa.s (25℃, Brookfield DVIII+)
• Shelf Life: 36 months (unopened)

Benefits:

• Enhances thermal conductivity and heat dissipation
• Protects CPU from overheating and damage
• Improves overall system performance and stability
• Suitable for air-cooled and liquid-cooled CPU systems
• User-friendly syringe design for easy application