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High-Performance Silicone Thermal Conductive Adhesive for Heatsink Bonding and Heat Dissipation

– Silicone thermal conductive heatsink plaster glue is a kind of adhesive that is used to fill the gap between the heat sink and the electronic component, to improve the heat dissipation efficiency.
– It is commonly used in electronic devices such as computers, laptops, and power supplies.
– The adhesive is made of silicone, which is a durable and flexible material that can withstand high temperatures.
– It is also electrically insulating, which makes it safe to use in electronic devices.

Original price was: ₹458.Current price is: ₹440.

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Description

Hot 10g HC-910 Silicone Thermal Conductive Adhesive Heatsink Plaster Glue –new

This is a HC-910 Silicone Thermal Conductive Adhesive Heatsink Plaster Glue. It is used for heating radiator, heat pipe, electronic semiconductor and heat sink and so on. It is easy to use and it can be applied to any surface. It performs well in resistance of high temperature, which is as high as 280 Celsius Degree; And low thermal impedance.

Product Features:

– Thermal conductivity: >1.10 W/m-k
– Temperature range: -60~280 Celsius Degree
– Density: 2.20 g/cm3
– Hardness: 30 Shore A
– Tensile strength: 1.8Mpa
– Elongation at break: 250%

Benefits:

– Easy to use and apply to any surface
– Resistance to high temperature
– Low thermal impedance
– Excellent thermal conductivity

To use:

1. Clean the surface of the heat sink and the electronic component.
2. Apply a thin layer of thermal paste to the surface of the heat sink.
3. Place the electronic component on the heat sink.
4. Apply pressure to the electronic component to ensure good contact between the heat sink and the electronic component.

Here are some additional features that make this product stand out from the competition:

– It is made of high-quality materials that are durable and long-lasting.
– It is available in a variety of colors to match your needs.

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    High-Performance Silicone Thermal Conductive Adhesive for Heatsink Bonding and Heat Dissipation