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High Performance CPU Thermal Interface Material for IC/Processor Cooling

– High thermal conductivity, low thermal resistance, and excellent insulation properties
– Non-toxic, halogen-free, and RoHS compliant
– Easy to apply and remove, no curing time required
– Available in various sizes and thicknesses to meet different application requirements
– Ideal for use in high-power electronic devices, such as CPUs, GPUs, and power modules

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Description

Thermal Grizzly Kryonaut Extreme 1g Thermal Interface Material

High-Performance CPU Thermal Interface Material for IC/Processor

Product Features:

– Engineered to provide exceptional heat transfer performance, effectively dissipating heat from CPUs and processors.
– Formulated with advanced nano-diamond particles that enhance thermal conductivity, ensuring efficient heat transfer.
– Offers excellent wetting properties, conforming seamlessly to uneven surfaces for optimal heat dissipation.
– Non-capacitive and non-electrically conductive, ensuring safe and reliable operation.
– Easy to apply with a spatula or brush, providing a thin and uniform layer for optimal heat transfer.

Benefits:

– Maximizes heat dissipation, preventing overheating and ensuring optimal performance of CPUs and processors.
– Extends component lifespan by reducing the risk of thermal damage.
– Maintains stability and reliability even under demanding operating conditions.
– Safe and easy to use, eliminating concerns about electrical or thermal issues.

Key Usage Points:

– Ideal for high-performance CPUs and processors in gaming systems, workstations, and servers.
– Can be used to replace pre-applied thermal paste or for custom thermal solutions.
– Suitable for both air-cooled and liquid-cooled systems.

Detailed Specifications:

– Thermal Conductivity: 12.5 W/mK (nano-diamond particles)
– Density: 3.95 g/cm³
– Viscosity: 150-200 Pa·s
– Application Temperature: -40°C to +125°C

Additional Features:

– Long service life, ensuring sustained thermal performance over time.
– Compatible with various CPU socket types and heatsinks.
– Non-toxic and environmentally friendly, reducing environmental impact.

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    High Performance CPU Thermal Interface Material for IC/Processor Cooling