Heatsink Thermal Grease Paste Compound CPU Cooler Silicone Adhesive-Cooling-Glue

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Overview:

Our Ultimate Heatsink Thermal Grease Paste Compound CPU Cooler Silicone Adhesive is tailored for maximum thermal conductivity and heat dissipation. Perfect for CPU coolers, VGA cards, IC Chipsets, Power transistors, and other electronic components that generate heat.

Product Features:

– Exceptional Thermal Conductivity: Effectively transfers heat from heat-generating components to heatsinks or cooling systems.
– Wide Operating Temperature Range: Withstands operating temperatures from -50°C to 280°C, ensuring stable performance under extreme conditions.
– Non-Toxic and Non-Conductive: Formulated with non-toxic, non-conductive materials, ensuring safe and reliable application.
– Low Bleed and Pump-Out: Minimal migration of paste over time, maintaining consistent thermal performance.
– Easy Application: Smooth, paste-like consistency allows for effortless application and removal.
– RoHS Compliant: Meets industry environmental standards, ensuring environmentally friendly use.

Benefits:

– Enhanced Heat Dissipation: Improved thermal transfer reduces operating temperatures for optimal performance and extended component lifespan.
– Reliable Performance: Withstands fluctuating temperatures and prevents thermal throttling, ensuring continuous and stable operation.
– Safe and Non-Conductive: Eliminates concerns about electrical hazards or component damage.
– Long-Lasting: Low bleed and pump-out properties maintain thermal performance over extended periods.
– Easy to Use: Convenient application and cleanup simplify maintenance and replacement.

Key Usage Points:

– CPU Coolers
– VGA Cards
– IC Chipsets
– Power Transistors
– Other Heat-Generating Electronic Components

Specifications:

– Thermal Conductivity: >5.15 W/m-K
– Thermal Resistance: <0.125-0.180 °C-cm2/W
– Operating Temperature Range: -50°C to 280°C
– Viscosity: 300-400 Pa.s (25°C)
– Density: 2.55-2.80 g/cm3

Additional Features:

– Non-Curing: Remains flexible over time, adapting to component and heatsink surfaces.
– Convenient Packaging: Available in various sizes and packaging options for different application needs.