Heatsink Thermal Grease Paste Compound CPU Cooler Silicone Adhesive Cooling Glu

Product Features:

– High thermal conductivity disperses heat from critical components quickly and efficiently.
– Low thermal resistance provides optimal heat dissipation and prevents overheating.
– Non-toxic and non-corrosive formula ensures safe and reliable application.
– Stable over a wide temperature range, ensuring consistent performance under various operating conditions.

Benefits:

– Improved cooling performance extends the lifespan of electronic devices.
– Reduces the risk of system malfunctions and data loss due to overheating.
– Ensures optimal thermal transfer, maximizing system stability and efficiency.
– Easy to apply, minimizing downtime and simplifying installation.

Usage:

– Thermal management in CPUs, GPUs, and other electronic components.
– Heat dissipation in power modules and heat sinks.
– Adhesive applications in various industrial and electronic devices.

Specifications:

– Thermal Conductivity: >4.5 W/mK
– Viscosity: 150-170 Pa.s
– Density: 2.8g/cm³
– Working Temperature Range: -50°C to 200°C

Additional Features:

– High stability and long shelf life.
– Compatible with various surface materials.
– OEM solutions to meet specific requirements.

Why Choose Our Thermal Grease?

– Trusted by professionals for superior thermal management.
– Rigorously tested to ensure exceptional performance and reliability.
– Backed by a commitment to customer satisfaction and technical support.