Heatsink Plasters Thermal Silicone Cooling Paste Strong B4B3 Adhesive C4F9

Heatsink Plasters Thermal Silicone Cooling Paste Strong B4B3 Adhesive C4F9 is a one-component, room temperature vulcanized silicone that is used for heat dissipation in electronic devices. It is formulated with high-quality materials and has excellent thermal conductivity, low thermal resistance, and good adhesion.

Product Features:

– High thermal conductivity: 1.5 W/m-K
– Low thermal resistance: 0.005°C-in²/W
– Good adhesion: Bonds to a variety of materials, including metals, ceramics, and plastics
– Easy to apply: Can be applied by hand or using a dispenser
– Non-corrosive: Will not damage electronic components
– RoHS compliant: Meets all RoHS requirements

Benefits:

– Improves heat dissipation in electronic devices
– Reduces the risk of overheating and damage
– Extends the lifespan of electronic devices
– Easy to apply and remove
– Safe to use on a variety of materials

Applications:

– Heat sinks
– CPUs
– GPUs
– Power transistors
– Other electronic components

Specifications:

– Color: Gray
– Viscosity: 100,000-300,000 mPa.s
– Specific gravity: 2.0-2.5
– Operating temperature range: -50°C to +200°C
– Shelf life: 12 months when stored in a cool, dry place

Additional Features:

– Cures at room temperature: No need for heat curing
– Non-toxic: Safe to use in electronic devices
– Meets all UL 94 V-0 flammability requirements

Why Choose Heatsink Plasters Thermal Silicone Cooling Paste?

Heatsink Plasters Thermal Silicone Cooling Paste is the ideal choice for heat dissipation in electronic devices. It is made with high-quality materials, has excellent thermal conductivity, and is easy to apply. It is also non-corrosive and RoHS compliant.