Heatsink Pad Cooler Pads for MOS IC Chip Memory Card Radiator 1PC

Product Description: The Thermal Pad is made of high-quality silicone, which possesses high thermal conductivity and excellent insulation. Its primary function is to transfer heat from heat-generating components like MOS IC chips or memory cards to a heatsink or chassis for better heat dissipation. Benefits: - Enhanced heat dissipation, reducing component temperature - Improved system stability and reliability - Extended component lifespan - Easy installation without the need for tools Product Features: - Ultra-thin design for space-constrained applications - Soft and pliable silicone material for excellent conformability - Thermal conductivity of 1.5 W/mK - Temperature range: -40°C to 200°C - Self-adhesive backing for secure attachment - Cuttable to fit various component sizes Key Usage Points: - Cooling of MOS IC chips in power modules - Heat dissipation for memory cards and other electronic components - Suitable for laptops, desktops, servers, and industrial applications Additional Features: - RoHS compliant for environmental safety - Non-toxic and non-corrosive Detailed Specifications: - Material: Silicone - Size: 100 x 100 x 1.5 mm - Weight: 5 grams Addressing User Concerns and Desires: - The thermal pad's conformability ensures efficient heat transfer even on uneven surfaces. - The cuttable design allows for customization to fit specific component sizes. - The adhesive backing provides a secure attachment, eliminating the need for messy thermal paste. External Links:

Thermal Pads: Materials and Applications

Choosing the Right Thermal Pad for Your Application