Heatsink Pad Cooler Pads for MOS IC Chip Memory Card Radiator 1PC

Product Description:
The Thermal Pad is made of high-quality silicone, which possesses high thermal conductivity and excellent insulation. Its primary function is to transfer heat from heat-generating components like MOS IC chips or memory cards to a heatsink or chassis for better heat dissipation.

Benefits:
– Enhanced heat dissipation, reducing component temperature
– Improved system stability and reliability
– Extended component lifespan
– Easy installation without the need for tools

Product Features:
– Ultra-thin design for space-constrained applications
– Soft and pliable silicone material for excellent conformability
– Thermal conductivity of 1.5 W/mK
– Temperature range: -40°C to 200°C
– Self-adhesive backing for secure attachment
– Cuttable to fit various component sizes

Key Usage Points:

– Cooling of MOS IC chips in power modules
– Heat dissipation for memory cards and other electronic components
– Suitable for laptops, desktops, servers, and industrial applications

Additional Features:
– RoHS compliant for environmental safety
– Non-toxic and non-corrosive

Detailed Specifications:
– Material: Silicone
– Size: 100 x 100 x 1.5 mm
– Weight: 5 grams

Addressing User Concerns and Desires:
– The thermal pad’s conformability ensures efficient heat transfer even on uneven surfaces.
– The cuttable design allows for customization to fit specific component sizes.
– The adhesive backing provides a secure attachment, eliminating the need for messy thermal paste.

External Links:

Thermal Pads: Materials and Applications

Choosing the Right Thermal Pad for Your Application