Soldering Chip and BGA Rework Station

Product Features: Accurate Temperature Control: - Ceramic heating core with a wide temperature range of 100 to 500°C (212 to 932°F). - PID temperature control for precise and stable heating. Efficient Desoldering: - Powerful suction system with adjustable airflow for effective desoldering and BGA removal. - Built-in vacuum pump for effortless solder removal. User-Friendly Design: - Intuitive digital display for easy temperature setting and monitoring. - Ergonomically designed handpiece for comfortable handling. - Compact and portable for convenient use. Versatile Applications: - Ideal for desoldering and reworking surface mount devices (SMDs) and Ball Grid Array (BGA) components. - Suitable for use in electronics repair, prototyping, and production environments. Durable Construction: - Heavy-duty steel construction for long-lasting durability. Additional Features: - LED lighting for improved visibility during operation. - Anti-static work surface to protect sensitive components. - Wide range of nozzle sizes (optional) for different desoldering requirements. Benefits: - Saves time and effort in the removal of SMDs and BGAs. - Ensures reliable and precise desoldering. - Enhances efficiency and productivity in electronics repair. - Offers flexibility with various nozzle options. - Provides durability and reliability for demanding applications. Specifications: - Temperature Range: 100 to 500°C (212 to 932°F) - Power: 220/110V, 50/60Hz - Suction Power: 0-60kPa - Airflow: 0-8L/min - Dimensions: 340 x 240 x 190mm - Weight: 12kg External Links:

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