Soldering Chip and BGA Rework Station

Product Features:

Accurate Temperature Control:
– Ceramic heating core with a wide temperature range of 100 to 500°C (212 to 932°F).
– PID temperature control for precise and stable heating.

Efficient Desoldering:
– Powerful suction system with adjustable airflow for effective desoldering and BGA removal.
– Built-in vacuum pump for effortless solder removal.

User-Friendly Design:
– Intuitive digital display for easy temperature setting and monitoring.
– Ergonomically designed handpiece for comfortable handling.
– Compact and portable for convenient use.

Versatile Applications:
– Ideal for desoldering and reworking surface mount devices (SMDs) and Ball Grid Array (BGA) components.
– Suitable for use in electronics repair, prototyping, and production environments.

Durable Construction:
– Heavy-duty steel construction for long-lasting durability.

Additional Features:

– LED lighting for improved visibility during operation.
– Anti-static work surface to protect sensitive components.
– Wide range of nozzle sizes (optional) for different desoldering requirements.

Benefits:

– Saves time and effort in the removal of SMDs and BGAs.
– Ensures reliable and precise desoldering.
– Enhances efficiency and productivity in electronics repair.
– Offers flexibility with various nozzle options.
– Provides durability and reliability for demanding applications.

Specifications:

– Temperature Range: 100 to 500°C (212 to 932°F)
– Power: 220/110V, 50/60Hz
– Suction Power: 0-60kPa
– Airflow: 0-8L/min
– Dimensions: 340 x 240 x 190mm
– Weight: 12kg

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