Heat Sink Thermal Conductive Cooling Modules for Orange 5 Development

• The heat sink is made of high-quality copper with high thermal conductivity, ensuring efficient heat dissipation.
• The surface of the heat sink is specially treated to enhance heat dissipation performance.
• Compact design and light weight for easy installation and compatibility with various devices.
• Durable construction for long-lasting performance under demanding conditions.

• Effectively dissipates heat from electronic components, preventing overheating and ensuring optimal performance.
• Extends the lifespan of electronic devices by reducing thermal stress.
• Improves the stability and reliability of electronic systems by maintaining a controlled temperature.

• Orange 5 Development Boards
• Microcontrollers and Processors
• Power Electronics
• High-Power LEDs
• Industrial Automation

• Material: Copper
• Dimensions: [Insert Dimensions]
• Thermal Conductivity: [Insert Thermal Conductivity]
• Weight: [Insert Weight]

• Compatible with most electronic devices that require heat dissipation.
• Available in multiple color options to match device aesthetics.