Heat Dissipation Silicone Pad 12.8W For CPU GPU Memory Motherboard Multifunction

Product Features:

1. Thermal conductivity: 12.8 W/m-K
2. Density: 3.45g/cm3
3. Color: Gray
4. Shape: Square
5. Size: 50x50mm
6. Thickness: 1.0mm

Benefits:

1. High thermal conductivity: Effectively dissipates heat from electronic components.
2. Soft and flexible: Conforms to uneven surfaces for optimal heat transfer.
3. Electrical insulation: Prevents short circuits and protects electronic components.
4. Easy installation: Self-adhesive backing for convenient application.
5. Versatile usage: Suitable for various electronic devices, including CPUs, GPUs, memory modules, and motherboards.

Usage points:

1. Apply to the surface of the heat-generating component.
2. Remove the protective film from the adhesive backing.
3. Align the pad with the corresponding heat sink and press firmly.
4. Ensure proper contact between the pad and both the component and heat sink.

Additional features:

• Non-toxic and environmentally friendly.
• Wide temperature range: -60°C to +200°C.
• Excellent flame resistance.