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High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules - Buy Online at Nilgiri Stores
High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules - Product Image
High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules - Product Image
High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules - Product Image
High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules - Product Image
ID: 694424 SKU: 3.94685E+11 Category: Electronic chips and boards Tags: 30days

High-Performance Aluminum Heatsink for Optimal Heat Dissipation in Computing Modules

About this item:

– Efficient heat dissipation for compute modules
– Lightweight aluminum construction with high thermal conductivity
– Passive cooling for extended durability
– Compatible with a wide range of modules
– Multiple mounting options for versatility

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Description

Heat Dissipation Compute Module Aluminum Heatsink Thermal

Specifications:

  • Material: Aluminum
  • Dimensions: 180 x 180 x 38mm (7.1 x 7.1 x 1.5 inches)
  • Weight: 4.8 ounces
  • Color: Black

Product Features:

  • Durable Construction: Constructed from high-grade aluminum alloy, this heatsink offers exceptional durability and longevity, ensuring reliable performance for extended periods.
  • Efficient Heat Dissipation: Its optimized fin design and large surface area maximize heat dissipation, effectively reducing operating temperatures and improving system stability.
  • Versatile Compatibility: The heatsink is compatible with various compute modules, making it a versatile solution for a range of applications.
  • Easy Installation: Designed for hassle-free installation, the heatsink comes with pre-drilled holes and mounting hardware, allowing for quick and easy integration.
  • Aesthetic Appeal: The sleek black finish adds a touch of sophistication to any setup and complements the aesthetics of modern compute systems.

Benefits:

  • Improved Thermal Performance: Enhanced heat dissipation capabilities ensure optimal operating temperatures, reducing the risk of overheating and system failures.
  • Increased System Stability: Reduced operating temperatures promote stable system operation, minimizing performance degradation and potential data loss.
  • Extended Component Lifespan: Effective heat dissipation helps prevent premature component failure, prolonging the lifespan of your compute module and other system components.
  • Versatile Applications: Compatibility with various compute modules makes it suitable for a wide range of applications, such as industrial automation, edge computing, and data centers.

Key Usage Points:

  • Suitable for compute modules that require efficient heat dissipation.
  • Ideal for applications where space is limited and thermal performance is critical.
  • Easy to install and maintain, minimizing downtime and maintenance costs.

Additional Features:

  • Optimized Fin Design: The heatsink's fin design ensures maximum heat dissipation efficiency, providing optimal cooling performance.
  • Pre-Drilled Holes: Pre-drilled mounting holes simplify installation, enabling quick and secure attachment to the compute module.
  • Corrosion Resistance: The aluminum alloy construction provides excellent corrosion resistance, ensuring durability in various environments.

Related Links:

  • Heat Sink Guide
  • Thermal Management in Electronics
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