Enhanced Heat Sink of Banana Board Cooling Pad with Adhesive Tape

A small but mighty addition to your cooling system, the Enhanced Heat Sink for Banana Board Cooling Pad with Adhesive Tape is a quick and easy way to improve heat dissipation and keep your board running smoothly. This heat sink is designed to fit perfectly on the Banana Board cooling pad, ensuring a secure and efficient connection. Product Features: - High-performance thermal conductive adhesive ensures maximum heat transfer between the heat sink and the board. - Aluminum alloy construction is durable and lightweight, providing excellent heat dissipation. - Compact and low-profile design makes it ideal for space-constrained applications. - Smooth surface finish reduces air resistance and improves cooling efficiency. - Easy installation with pre-applied adhesive tape, no tools required. Benefits: - Reduces operating temperatures to extend the lifespan of your board. - Improves system stability by preventing overheating and performance degradation. - Enhances overall cooling performance, especially in demanding applications. - Quick and easy installation saves time and effort. Usage: The Enhanced Heat Sink for Banana Board Cooling Pad with Adhesive Tape is ideal for use in various applications, including: - Industrial automation - Networking equipment - Embedded systems - Data acquisition devices Technical Specifications: - Material: Aluminum alloy - Dimensions: 25mm x 25mm x 10mm - Weight: 5g - Thermal conductivity: 236 W/m-K - Adhesive type: Thermal conductive adhesive Additional Features: - Unlike other heat sinks, this model features a pre-applied adhesive tape for hassle-free installation, eliminating the need for tools or screws. For more information on heat sink installation and best practices, refer to the following resources:

How to Install a Heatsink

Heatsink Selection and Installation Guide