Enhanced Heat Sink of Banana Board Cooling Pad with Adhesive Tape

A small but mighty addition to your cooling system, the Enhanced Heat Sink for Banana Board Cooling Pad with Adhesive Tape is a quick and easy way to improve heat dissipation and keep your board running smoothly. This heat sink is designed to fit perfectly on the Banana Board cooling pad, ensuring a secure and efficient connection.

Product Features:

– High-performance thermal conductive adhesive ensures maximum heat transfer between the heat sink and the board.
– Aluminum alloy construction is durable and lightweight, providing excellent heat dissipation.
– Compact and low-profile design makes it ideal for space-constrained applications.
– Smooth surface finish reduces air resistance and improves cooling efficiency.
– Easy installation with pre-applied adhesive tape, no tools required.

Benefits:

– Reduces operating temperatures to extend the lifespan of your board.
– Improves system stability by preventing overheating and performance degradation.
– Enhances overall cooling performance, especially in demanding applications.
– Quick and easy installation saves time and effort.

Usage:

The Enhanced Heat Sink for Banana Board Cooling Pad with Adhesive Tape is ideal for use in various applications, including:

– Industrial automation
– Networking equipment
– Embedded systems
– Data acquisition devices

Technical Specifications:

– Material: Aluminum alloy
– Dimensions: 25mm x 25mm x 10mm
– Weight: 5g
– Thermal conductivity: 236 W/m-K
– Adhesive type: Thermal conductive adhesive

Additional Features:

– Unlike other heat sinks, this model features a pre-applied adhesive tape for hassle-free installation, eliminating the need for tools or screws.

For more information on heat sink installation and best practices, refer to the following resources: