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Direct Heating 130×130 BGA Reballing Stencil Platform Set for DDR6 BGA180 Chip Repair and Rework

– Designed For DDR6 BGA180 IC Chips
– Used for reballing BGA IC chips
– Made of high-temperature resistant composite material
– Precise positioning, easy to operate
– durable and long-lasting

1,970

Shipping cost extra*
Description

Direct heating 130×130 BGA Reballing Stencil Platform Set For DDR6 BGA180

Product Features:

Compatibility: This reballing stencil platform set is exclusively designed for DDR6 BGA180, ensuring precise alignment and effective reballing operations.

Direct Heating: The platform utilizes direct heating technology, providing efficient and targeted heat distribution for optimal solder reflow.

Adjustable Temperature: With a wide temperature range, you can customize the heating process to suit specific solder paste requirements and achieve optimal results.

Precision Alignment: The stencil platform features high-precision alignment, ensuring accurate placement of solder balls and preventing misalignment issues.

Durability: Constructed from premium materials, the platform is built to withstand repeated use and harsh soldering conditions, ensuring long-lasting performance.

Easy Installation: The platform is designed for quick and effortless installation, saving you time and effort during the reballing process.

Compact Design: Its compact footprint allows for easy storage and portability, making it ideal for both professional repair centers and hobbyists alike.

Versatile Applications: This reballing stencil platform set finds wide application in mobile phone, laptop, and other electronic device repairs, making it a versatile tool for various soldering tasks.

Benefits:

– Precise and efficient reballing for DDR6 BGA180 devices.
– Enhanced solder reflow quality through direct heating technology.
– Adjustable temperature control for optimal solder paste performance.
– Accurate alignment for seamless solder ball placement and reduced defects.
– Durable construction for extended service life.
– Convenient installation and compact design for ease of use.
– Suitable for a wide range of electronic repair applications.

Specifications:

– Compatible Chip: DDR6 BGA180
– Heating Method: Direct Heating
– Temperature Range: Adjustable
– Platform Size: 130x130mm
– Stencil Aperture Size: 0.6mm
– Stencil Thickness: 0.12mm

External Links:

  • Product Manufacturer’s Website

  • Tutorial: Using Direct Heating Reballing Stencil Platform
  • SKU: 266347341632 Category: Tag:

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    Direct Heating 130×130 BGA Reballing Stencil Platform Set for DDR6 BGA180 Chip Repair and Rework