DDR5 BGA170 BGA Reballing Stencil GPU IC Chip Steel Mesh Planting Balls Beads

This is a DDR5 BGA170 BGA Reballing Stencil GPU IC Chip Steel Mesh Planting Balls Beads.

Product Features:

• High precision laser cut stencil for BGA/CSP IC reballing
• Made of high quality stainless steel, durable and reusable
• Various apertures and pitches for different IC sizes and pitches
• Easy to use and align, significantly reducing reballing time and effort
• Helps to create precise solder joints and improve the reliability of the chip after reballing

Applications:

• Reballing of DDR5 BGA170 GPUs and other IC chips
• Repairing faulty or damaged IC chips
• Upgrading or replacing IC chips on electronic devices

Key Features:

• Material: Stainless Steel
• Aperture: 0.15mm
• Pitch: 0.25mm
• Dimensions: 30mm x 25mm
• Thickness: 0.1mm

Benefits:

• Improves the accuracy and efficiency of the reballing process
• Reduces the risk of solder bridging and other defects
• Extends the life of the IC chip and the electronic device
• Cost-effective solution for repairing or upgrading electronic devices