Copper Heatsink with Thermally Conductive Adhesive

Product Features:
– Improved heat dissipation
– Decreased operating temperatures
– Ideal for use in tight spaces
– More effective cooling
– Clean and easy installation

Product Description:
Our copper heatsink and thermally conductive adhesive are the perfect solution for cooling your mSATA NGFF 5030 device. The heatsink is made of high-quality copper, which is an excellent conductor of heat. This means that it can quickly dissipate heat away from your device, keeping it cool and running at optimal temperatures.

The adhesive included is also thermally conductive, which means that it helps to transfer heat from the device to the heatsink. This further improves cooling efficiency.

The heatsink is easy to install and can be attached to your device using the included screws. It is also very durable and can withstand high temperatures.

Benefits:
– Improved heat dissipation
– Decreased operating temperatures
– Ideal for use in tight spaces
– More effective cooling
– Clean and easy installation

Specifications:

Material: Copper
Dimensions: 22mm x 22mm x 10mm
Weight: 5g
Adhesive Type: Thermally conductive adhesive
Package Includes:
1 x Copper heatsink
1 x Thermally conductive adhesive