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BM120 Pad Coated Fiberglass Thermal Silicone Pad for Heat Sink IGBT MOS Transistor Cooling

– BM120 Thermal Pad ideal for electronic components, electrical insulation, and heat dissipation.
– Pad coated to provide high adhesion to both sides.
– Durable material with excellent thermal conductivity and electrical insulation.
– Other features include resistance to high temperatures, corrosion, and oxidation.

Original price was: ₹3,060.Current price is: ₹2,943.

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Description

BM120 Pad Coated Fiberglass Thermal Silicone Pad for Heat Sink IGBT MOS Transis

BM120 is a thermal silicone pad series with fiberglass fabrics coated. It is typically used as a heat conductive interface material in electronic devices. It is a suitable solution for applications where low thermal resistance, high reliability, and excellent flexibility are required.

Product Features:

  • Excellent thermal conductivity to effectively transfer the heat generated by electronic components.
  • Soft and conformable. Easily adapts to various surface shapes and topography. Reduces the thermal contact resistance and improves temperature uniformity by filling the airspace between surfaces.
  • High dielectric strength for electrical insulation.
  • Non-curing and non-toxic. No need for any curing process and doesn’t release any hazardous substances.
  • Tacky surface is easy to install and remove. Enhances thermal performance during use and enables repositioning or replacement if necessary.
  • Wide operating temperature range. Maintains consistent thermal performance in extreme temperature conditions.
  • Applications:

  • Filling gaps between heat sinks and electronic components
  • Heat dissipation in electronic packaging
  • Thermal management in power modules, IGBTs, and MOSFETs
  • Cooling sensitive electronic components in laptops, smartphones, and other devices
  • Key Features:

  • Thermal Conductivity: 1.2 W/m-K
  • Thickness: 0.5mm, 1.0mm, 1.5mm, 2.0mm
  • Density: 2.8 g/cm³
  • Specific Heat: 0.35 J/g-°C
  • Operating Temperature Range: -40°C to +200°C
  • Dielectric Strength: 10 kV/mm
  • Fiberglass Reinforcement: Yes
  • Color: Light Blue
  • Standard Size: 200mm x 400mm
  • Advantages:

  • Improves heat dissipation and lowers component temperatures.
  • Protects sensitive electronics from overheating.
  • Reduces the risk of component failure and extends device life.
  • Easy to install and maintain, saving time and labor costs.
  • Versatile and can be used in various electronic applications.
  • Compliant with RoHS and REACH regulations.
  • Available in standard sizes and can be customized to meet specific requirements.
  • Cost-effective and provides a long-term solution for thermal management.
  • BM120 Thermal Silicone Pad datasheet
  • SKU: 385800327054 Category: Tag:

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    BM120 Pad Coated Fiberglass Thermal Silicone Pad for Heat Sink IGBT MOS Transistor Cooling