BGA Reballing Stencils DDR5 BGA170 Solder Steel Template BGA Station

Product Features:

– Made of high-quality steel for durability
– Designed with precision for accurate reballing
– Easy to install and use
– Provides consistent results
– Compatible with a wide range of BGA packages
– Available in various sizes to meet different needs

Benefits:

– Improves the efficiency of BGA reballing
– Reduces the risk of damage to the BGA package
– Ensures a high-quality solder joint
– Extends the lifespan of the BGA component

Applications:

– Reballing of BGA components
– Repair of BGA circuit boards
– Production of new BGA assemblies

Specifications:

– Material: Steel
– Thickness: 0.1mm
– Size: 12x12mm, 14x14mm, 16x16mm, 18x18mm, 20x20mm
– Pitch: 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm

Additional Features:

– Color-coded for easy identification
– Comes with a protective case for storage
– Meets industry standards for quality and performance

Why Choose Our BGA Reballing Stencils?

– Our stencils are made of high-quality steel for durability and precision.
– We offer a wide range of sizes to meet different needs.
– Our stencils are easy to install and use, providing consistent results.
– We are a trusted supplier of BGA reballing stencils to businesses and individuals worldwide.