BGA Reballing Stencils DDR5 BGA170 Solder Steel Template BGA Station

Product Features: - Made of high-quality steel for durability - Designed with precision for accurate reballing - Easy to install and use - Provides consistent results - Compatible with a wide range of BGA packages - Available in various sizes to meet different needs Benefits: - Improves the efficiency of BGA reballing - Reduces the risk of damage to the BGA package - Ensures a high-quality solder joint - Extends the lifespan of the BGA component Applications: - Reballing of BGA components - Repair of BGA circuit boards - Production of new BGA assemblies Specifications: - Material: Steel - Thickness: 0.1mm - Size: 12x12mm, 14x14mm, 16x16mm, 18x18mm, 20x20mm - Pitch: 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm Additional Features: - Color-coded for easy identification - Comes with a protective case for storage - Meets industry standards for quality and performance Why Choose Our BGA Reballing Stencils? - Our stencils are made of high-quality steel for durability and precision. - We offer a wide range of sizes to meet different needs. - Our stencils are easy to install and use, providing consistent results. - We are a trusted supplier of BGA reballing stencils to businesses and individuals worldwide.

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