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Precision BGA Reballing Stencil for DDR6 BGA180 IC Chip Repair and Soldering

– For those who need to reball DDR6 BGA180 IC
– Features precise alignment and evenly distributed solder paste
– Durable steel mesh construction ensures longevity
– Available in various sizes and options to meet specific needs
– Additional features include anti-static and heat-resistant properties

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Description

BGA Reballing Stencil for DDR6 BGA180 Tin Planting Steel Mesh IC Solder Template

Product Features:

– Tin planting steel mesh stencil for DDR6 BGA180

– Made of high-grade stainless steel, durable and easy to use

– Precise cutting ensures precise tin planting and soldering

– Compatible with BGA180 packages

– Size: 70mm x 70mm

Benefits:

– Enables precise tin planting on BGA180 packages

– Facilitates efficient and reliable soldering

– Designed for durability and long-lasting performance

Product Specifications:

– Material: Stainless steel

– Size: 70mm x 70mm

– Thickness: 0.1mm

– Pattern: BGA180

Usage Points:

– Easy to install and use

– Ideal for tin planting and soldering BGA180 packages

– Provides accurate alignment for precise soldering

– Compatible with various solder paste types

  • Learn more about BGA reballing stencils on EEVblog
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    Precision BGA Reballing Stencil for DDR6 BGA180 IC Chip Repair and Soldering