BGA Reballing Stencil Direct Heating Solder Steel Template for DDR5X BGA190

Product Features:

– High-quality direct heating steel stencil for BGA reballing
– Compatible with DDR5X BGA190 chips
– Precise alignment and accurate solder paste deposition
– Durable and reusable

Product Benefits:

– Enhances the efficiency and accuracy of BGA reballing
– Prevents solder bridging and ensures reliable connections
– Facilitates precise solder paste application for improved board performance

Product Features in Detail:

– Material: High-strength steel alloy
– Thickness: 0.15 mm
– Aperture Size: Customized to match DDR5X BGA190 chip layout
– Alignment Accuracy: +/-0.05 mm
– Reusable: Can be used multiple times with proper cleaning and maintenance

Usage Instructions:

– Clean the stencil and BGA chip thoroughly before use.
– Apply solder paste to the stencil apertures.
– Align the stencil over the BGA chip and gently press to transfer the solder paste.
– Remove the stencil and place the BGA chip on the board for reflow soldering.

Why Choose This Product?

– High precision and accuracy for professional-grade BGA reballing
– Durable design ensures longevity and cost-effectiveness
– Backed by a satisfaction guarantee

Additional Information: