Aluminum HeatSink for Orange 5 Development Board Cpus Cooling Modules

Prevent overheating of CPUs, RAM, and other ICs with our Aluminum HeatSink for Orange 5 Development Boards. This heatsink features:

Product Features:

– Efficient Cooling: Superior heat dissipation for optimal performance and longevity of your development board.
– Durable Construction: Precision-crafted from lightweight and robust aluminum for exceptional durability.
– Compact Design: Perfectly matches the form factor of Orange 5 development boards for seamless integration.
– Easy Installation: Quick and effortless assembly with screws, ensuring a secure fit.
– Versatile Fit: Compatible with multiple variants of Orange 5 development boards for wide-ranging use.
– Enhanced Heat Transfer: Extended surface area and efficient design facilitate maximum heat transfer.
– Black Anodized Finish: Corrosion-resistant and aesthetically pleasing finish complements the board’s appearance.
– Thermal Interface Material Included: Pre-applied thermal pads ensure optimal heat transfer between the heat source and the heatsink.
– Dimension: 30mm x 30mm x 10mm

Key Usage Points:

– Prevents thermal throttling and performance degradation in CPUs.
– Extends the lifespan of development boards by mitigating overheating damage.
– Essential cooling component for demanding tasks and high-temperature environments.
– Provides a stable and reliable platform for development and prototyping.

Relevant External Links:

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