Aluminum HeatSink for Orange 5 Development Board Cpus Cooling Modules

Prevent overheating of CPUs, RAM, and other ICs with our Aluminum HeatSink for Orange 5 Development Boards. This heatsink features: Product Features: - Efficient Cooling: Superior heat dissipation for optimal performance and longevity of your development board. - Durable Construction: Precision-crafted from lightweight and robust aluminum for exceptional durability. - Compact Design: Perfectly matches the form factor of Orange 5 development boards for seamless integration. - Easy Installation: Quick and effortless assembly with screws, ensuring a secure fit. - Versatile Fit: Compatible with multiple variants of Orange 5 development boards for wide-ranging use. - Enhanced Heat Transfer: Extended surface area and efficient design facilitate maximum heat transfer. - Black Anodized Finish: Corrosion-resistant and aesthetically pleasing finish complements the board's appearance. - Thermal Interface Material Included: Pre-applied thermal pads ensure optimal heat transfer between the heat source and the heatsink. - Dimension: 30mm x 30mm x 10mm Key Usage Points: - Prevents thermal throttling and performance degradation in CPUs. - Extends the lifespan of development boards by mitigating overheating damage. - Essential cooling component for demanding tasks and high-temperature environments. - Provides a stable and reliable platform for development and prototyping. Relevant External Links: -

Orange Pi 5 Tutorial -

Armbian for Orange Pi 5