Aluminum Anti-bending Contact Frame for 12th Gen. CPU LGA1700-BCF

What is a LGA1700 anti-bending contact frame? The LGA1700 Anti-bending Contact Frame is specifically designed to achieve optimal contact between the CPU and the motherboard, eliminating any potential bending or warping of the CPU during installation or usage. This ensures maximum heat transfer and electrical connectivity, resulting in improved system stability and performance. Features:

• Enhanced Thermal Performance: Aluminum's high thermal conductivity ensures efficient heat dissipation, preventing overheating and throttling.
• Anti-bending Reinforcement: Rigid aluminum construction safeguards against CPU bending caused by uneven mounting pressure, ensuring a firm and stable connection.
• Precision Machining: Precisely engineered to align perfectly with the LGA1700 socket, guaranteeing optimal contact for both LGA 115x and 1200 series CPUs.
• Easy Installation: Intuitive design allows for effortless installation, ensuring a quick and hassle-free setup.
• Durable Construction: Made of premium-grade aluminum for exceptional durability and longevity.

Benefits:

- Protects the CPU from bending or warping during installation and usage. - Significantly improves heat transfer efficiency, optimizing cooling and preventing overheating. - Ensures stable and reliable electrical connectivity for optimal system performance. - Compatible with a wide range of motherboards with LGA1700, LGA 115x, and 1200 series sockets to support various CPU models.

Product Specifications:

Material:	Aluminum
Dimensions:	8cm x 8cm
Socket Compatibility:	LGA1700, LGA 115x, 1200
Weight:	100 grams

Intel's LGA1700 Socket Specifications