4 Pieces Universal BGA Reballing Stencil

Product Features:

This universal BGA reballing stencil set offers a comprehensive solution for precise reballing of various BGA chip sizes. The stencils are meticulously crafted from high-grade stainless steel, ensuring durability and reliable performance. Each stencil features laser-cut apertures that perfectly align with BGA pads, enabling accurate solder ball placement.

Benefits:

– Precise reballing for enhanced component reliability
– Universal compatibility with a wide range of BGA chip sizes
– Durable stainless steel construction for long-lasting usage
– Laser-cut apertures for precise solder ball placement

Key Usage Points:

– Easy installation and removal for efficient reballing
– Suitable for both lead-free and tin-lead solder balls
– Ideal for rework, repair, and production applications

Specifications:

– Material: Stainless steel
– Stencil Size: 110 x 110mm
– Thickness: 0.1mm
– Aperture Sizes: Compatible with various BGA chip sizes

Additional Features:

– Anti-static design prevents electrostatic discharge damage
– Precision-engineered to ensure consistent reballing results
– Easy-to-clean surface for hassle-free maintenance

Highlights:

– Universal compatibility eliminates the need for multiple stencils
– Durable construction ensures longevity and reliability
– Precision apertures guarantee accurate solder ball placement
– Anti-static design safeguards components from damage

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