4 Pieces Universal BGA Reballing Stencil

Product Features: This universal BGA reballing stencil set offers a comprehensive solution for precise reballing of various BGA chip sizes. The stencils are meticulously crafted from high-grade stainless steel, ensuring durability and reliable performance. Each stencil features laser-cut apertures that perfectly align with BGA pads, enabling accurate solder ball placement. Benefits: - Precise reballing for enhanced component reliability - Universal compatibility with a wide range of BGA chip sizes - Durable stainless steel construction for long-lasting usage - Laser-cut apertures for precise solder ball placement Key Usage Points: - Easy installation and removal for efficient reballing - Suitable for both lead-free and tin-lead solder balls - Ideal for rework, repair, and production applications Specifications: - Material: Stainless steel - Stencil Size: 110 x 110mm - Thickness: 0.1mm - Aperture Sizes: Compatible with various BGA chip sizes Additional Features: - Anti-static design prevents electrostatic discharge damage - Precision-engineered to ensure consistent reballing results - Easy-to-clean surface for hassle-free maintenance Highlights: - Universal compatibility eliminates the need for multiple stencils - Durable construction ensures longevity and reliability - Precision apertures guarantee accurate solder ball placement - Anti-static design safeguards components from damage External Links for More Information:

BGA Reballing Stencil Guide

Using a BGA Reballing Stencil