3g HY610-TU05A Thermal Grease Chipset CPU Cooling Compound Silicone 3.05W

Product Description: This thermal grease is a high-performance thermal compound designed to improve heat transfer between electronic components and heat sinks. It is composed of premium-grade silicone-based materials, ensuring excellent thermal conductivity and long-term stability. This grease is widely used in cooling applications of CPUs, GPUs, power modules, and other electronic devices that require effective heat dissipation. Benefits: * Enhanced heat transfer for improved system cooling * Reduced operating temperatures, leading to increased component lifespan * Compatibility with various electronic devices * Easy application and long-term durability Features: * Thermal conductivity: 3.05W/m-K * Operating temperature range: -50°C to +200°C * Specific gravity: 2.6 * Dielectric strength: >20KV/mm * Volume: 3 grams Usage: * To apply the thermal grease, clean the surfaces of the CPU and heatsink to remove any dust or debris. * Use a small amount of grease, typically a pea-sized amount, and spread it evenly over the CPU surface. * Install the heatsink and tighten it securely to ensure good contact with the CPU. * Excess grease should be wiped away with a clean cloth. Why Choose Our Thermal Grease? * High Thermal Conductivity: The thermal conductivity of 3.05W/m-K ensures efficient heat transfer, preventing overheating. * Wide Compatibility: This grease is compatible with various electronic devices, including CPUs, GPUs, and power modules. * Durable Formulation: The silicone-based formula provides long-term stability and durability, maintaining its performance over time. * Easy Application: Its paste-like consistency allows for easy application, reducing the risk of any air pockets or uneven distribution. Additional Features: * Non-toxic and non-corrosive, ensuring safety during use * Wide operating temperature range to accommodate different applications

Thermal Grizzly Hydronaut Thermal Paste for alternative thermal grease options.