3g HY610-TU05A Thermal Grease Chipset CPU Cooling Compound Silicone 3.05W

Product Description:

This thermal grease is a high-performance thermal compound designed to improve heat transfer between electronic components and heat sinks. It is composed of premium-grade silicone-based materials, ensuring excellent thermal conductivity and long-term stability. This grease is widely used in cooling applications of CPUs, GPUs, power modules, and other electronic devices that require effective heat dissipation.

Benefits:

* Enhanced heat transfer for improved system cooling
* Reduced operating temperatures, leading to increased component lifespan
* Compatibility with various electronic devices
* Easy application and long-term durability

Features:

* Thermal conductivity: 3.05W/m-K
* Operating temperature range: -50°C to +200°C
* Specific gravity: 2.6
* Dielectric strength: >20KV/mm
* Volume: 3 grams

Usage:

* To apply the thermal grease, clean the surfaces of the CPU and heatsink to remove any dust or debris.
* Use a small amount of grease, typically a pea-sized amount, and spread it evenly over the CPU surface.
* Install the heatsink and tighten it securely to ensure good contact with the CPU.
* Excess grease should be wiped away with a clean cloth.

Why Choose Our Thermal Grease?

* High Thermal Conductivity: The thermal conductivity of 3.05W/m-K ensures efficient heat transfer, preventing overheating.
* Wide Compatibility: This grease is compatible with various electronic devices, including CPUs, GPUs, and power modules.
* Durable Formulation: The silicone-based formula provides long-term stability and durability, maintaining its performance over time.
* Easy Application: Its paste-like consistency allows for easy application, reducing the risk of any air pockets or uneven distribution.

Additional Features:

* Non-toxic and non-corrosive, ensuring safety during use
* Wide operating temperature range to accommodate different applications