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High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance - Buy Online at Nilgiri Stores
High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance - Product Image
High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance - Product Image
High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance - Product Image
High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance - Product Image
ID: 698696 SKU: 3.95E+11 Category: Electronic parts Tags: 30days

High-Performance 2g Thermal Compound Paste for Enhanced Heat Sink Performance

About this item:

- Ideal for dissipating heat from electronic components, such as CPUs and GPUs. - Provides a thermal conductivity of 12.8W/m-K to ensure efficient heat transfer. - Durable silicone construction offers excellent longevity. - Available in various sizes and thicknesses to suit different applications. - Non-toxic and environmentally friendly, making it safe for use in sensitive electronics.

2316

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Delivered in 30-60 days
On Pre-Order
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  • Guaranteed delivery
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  • Regular orders dispatch in 48 Hours
  • Pre-orders dispatch in 30-45 days
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Description

2g 12.8W/m-K Silicone Plaster Heatsink Performances Thermal Compound Pastes

Product Features:
  • Introducing a revolutionary thermal management solution with our 2g 12.8W/m-K Silicone Plaster Heatsink Thermal Compound Pastes.
  • Engineered to meet the demanding cooling requirements of high-performance electronic devices, our thermal compound pastes effectively dissipate heat, ensuring optimal performance and longevity.
Key Benefits:
  • Exceptional thermal conductivity of 12.8W/m-K ensures efficient heat transfer, preventing overheating and maintaining optimal temperatures.
  • The silicone plaster-based formula provides excellent conformability, filling microscopic air gaps and maximizing surface contact for superior heat dissipation.
  • Easy to apply and remove, our thermal compound pastes offer a convenient and efficient solution for thermal management.
Versatility and Applications:
  • Widely applicable to various electronic devices, including CPUs, GPUs, power modules, and heat sinks.
  • Ideal for use in high-performance computing, gaming systems, industrial automation, and other applications requiring effective heat management.
Additional Features:
  • Non-toxic and environmentally friendly, ensuring safe and responsible use.
  • Long-lasting performance, providing consistent thermal conductivity over extended periods.
  • Available in multiple color options to complement the aesthetics of your devices.
Detailed Specifications:
Property Value
Thermal Conductivity 12.8W/m-K
Density 2.0g/cm³
Operating Temperature Range -50°C to +200°C
Viscosity 100,000~200,000 mPa·s
Weight 2g
Addressing User Concerns:
  • Our thermal compound pastes are highly durable and provide long-lasting performance, ensuring reliable heat dissipation throughout the lifespan of your devices.
  • To ensure optimal results, ensure the surfaces are clean and free from any dirt or debris before applying the paste.
  • For specific application instructions and technical details, please refer to the product's user manual or consult with a qualified technician.
External Links for Further Information:

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