27PCS Universal BGA Reballing Stencils Template for Precise Solder Application and Heat Transfer.
– Professional BGA reballing stencils, widely used for reballing and replacing laptop, desktop, and Sony PS3/4/5 BGA IC chips.
– Durable steel mesh, high-temperature resistant, oxidation resistant, and can be cleaned and reused multiple times.
– Full solder balls required (not included) to be placed on the stencil, then the stencil is heated and the balls melt down and fall through the stencil onto the pads of the BGA component.
– Compatible with various chip sizes such as 0.4mm, 0.5mm, 0.6mm, 0.76mm, and 1.0mm.
– Comes with a storage box for easy organization and protection.
₹2,004
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