27Pcs/Set BGA Universal Stencils Reballing Reball Rework Net Heated Template Set

Product Features:

– 27 universal BGA stencils to seamlessly align and solder BGA chips in place, ideal for repairing defective or faulty BGA components.
– Crafted from durable stainless steel material, ensuring long-lasting performance and resistance to wear and tear.
– Facilitates precise application of solder paste to the BGA chip, eliminating the risk of bridging and short circuits.
– Enhances accuracy and efficiency during the reballing process, simplifying complex repairs.
– Optimised for lead-free soldering, catering to the latest industry standards.
– Stencils are labelled for convenience, making it easy to identify and select the appropriate stencil for your specific BGA model.

Key Benefits:

– Enables the precise and professional reballing of BGA chips, empowering users to restore the functionality of defective devices.
– Ensures secure and reliable solder joints, reducing the risk of rework and premature failures.
– Streamlines the repair process, saving time and effort compared to using conventional methods.
– Compatible with a wide range of BGA models, making it a versatile tool for electronic repairs.
– Offers excellent value for money, providing a durable and effective solution for multiple reballing applications.