13.8W/m-K Silicone Plaster Heatsink Performances Thermal Compound Pastes

These silicone plaster thermal compound pastes deliver impressive thermal conductivity of 13.8W/m-K, making them ideal for high-performance cooling applications. They are designed to enhance heat dissipation by filling the microscopic air pockets between a heat source and a heatsink, thereby maximizing thermal transfer. Product Features: * Exceptional thermal conductivity of 13.8W/m-K for superior heat dissipation * Easy application with a non-curing formula * Durable and long-lasting, providing reliable performance over an extended period * Available in various viscosities to suit different applications Key Usage Points: * Cooling electronic components, such as CPUs, GPUs, and power transistors * Improving heat transfer in heatsinks, thermal pads, and other cooling devices * Repairing damaged thermal interfaces * Enhancing cooling efficiency in a wide range of industries, including electronics, aerospace, and automotive Benefits: * Lower operating temperatures for electronic components, increasing reliability and lifespan * Reduced thermal resistance, ensuring efficient heat transfer * Improved system stability and performance * Enhanced cooling performance in space-constrained applications Additional Features: * Non-toxic and environmentally friendly * Wide operating temperature range * Compatible with various surfaces, including metal, ceramic, and plastic Specifications: * Thermal conductivity: 13.8W/m-K * Density: 2.0g/cm³ * Viscosity: 100,000-1,000,000 mPa·s * Operating temperature: -50°C to +250°C

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