13.8W/m-K Silicone Plaster Heatsink Performances Thermal Compound Pastes

These silicone plaster thermal compound pastes deliver impressive thermal conductivity of 13.8W/m-K, making them ideal for high-performance cooling applications. They are designed to enhance heat dissipation by filling the microscopic air pockets between a heat source and a heatsink, thereby maximizing thermal transfer.

Product Features:

* Exceptional thermal conductivity of 13.8W/m-K for superior heat dissipation
* Easy application with a non-curing formula
* Durable and long-lasting, providing reliable performance over an extended period
* Available in various viscosities to suit different applications

Key Usage Points:

* Cooling electronic components, such as CPUs, GPUs, and power transistors
* Improving heat transfer in heatsinks, thermal pads, and other cooling devices
* Repairing damaged thermal interfaces
* Enhancing cooling efficiency in a wide range of industries, including electronics, aerospace, and automotive

Benefits:

* Lower operating temperatures for electronic components, increasing reliability and lifespan
* Reduced thermal resistance, ensuring efficient heat transfer
* Improved system stability and performance
* Enhanced cooling performance in space-constrained applications

Additional Features:

* Non-toxic and environmentally friendly
* Wide operating temperature range
* Compatible with various surfaces, including metal, ceramic, and plastic

Specifications:

* Thermal conductivity: 13.8W/m-K
* Density: 2.0g/cm³
* Viscosity: 100,000-1,000,000 mPa·s
* Operating temperature: -50°C to +250°C