13.4w/m-k HY-P13 Extreme Performance 2g Thermal Paste Grease Silicone Paste CPU

In the world of high-performance computing, thermal paste is an essential element for ensuring optimal heat dissipation and maintaining the stability of sensitive electronic components. Among the various thermal paste options available in the market, HY-P13 Extreme Performance Thermal Paste stands out as an exceptional solution for demanding applications. Product Features: ✅ Ultra-High Thermal Conductivity: With a remarkable thermal conductivity of 13.4w/m-k, HY-P13 effectively transfers heat away from critical components, preventing overheating and ensuring optimal performance. ✅ Wide Application: HY-P13 is compatible with a broad range of electronic devices, including CPUs, GPUs, power transistors, and heatsinks. Its versatility makes it an ideal solution for enthusiasts and professionals alike. ✅ Non-Conductive and Non-Curing: Unlike metallic thermal pastes, HY-P13 is non-conductive, eliminating any risk of short circuits. Additionally, it remains non-curing over time, ensuring long-term reliability and easy maintenance. ✅ Syringe Applicator: The convenient syringe applicator provides precise dispensing and minimizes waste. The syringe design allows for controlled application, eliminating the need for additional tools and reducing the risk of applying excessive or insufficient amounts. ✅ Temperature Range: HY-P13 maintains its effectiveness over a wide temperature range (-50°C to 220°C), ensuring consistent performance in extreme operating conditions. ✅ Versatile Color Options: HY-P13 is available in two color options (gray and silver) to complement different aesthetic preferences and system designs.

Why Choose HY-P13 Thermal Paste?

Compared to standard thermal pastes, HY-P13 offers several key advantages: ✅ Unparalleled Thermal Performance: Its exceptional thermal conductivity ensures maximum heat dissipation, resulting in significantly lower operating temperatures for critical components. ✅ Enhanced Reliability: The non-conductive and non-curing nature of HY-P13 eliminates the risks associated with metallic thermal pastes, providing peace of mind and long-lasting performance. ✅ Easy Installation and Maintenance: The syringe applicator simplifies the application process, reducing the risk of improper installation and ensuring optimal heat transfer. The non-curing formula allows for easy cleaning and maintenance, if necessary.

Additional Features:

In addition to its core features, HY-P13 Thermal Paste also boasts several other valuable attributes: ✅ Safe for Use on All Surfaces: Its composition is compatible with all common CPU and heatsink surfaces, ensuring safe and effective application. ✅ Long Service Life: HY-P13 maintains its thermal conductivity and performance over extended periods, providing years of reliable service. ✅ Widely Recommended: HY-P13 is highly regarded by enthusiasts and professionals in the overclocking and extreme performance computing communities.

Specifications:

✅ Thermal Conductivity: 13.4w/m-k ✅ Specific Gravity: 2.5g/cm³ ✅ Viscosity: 120,000cps ✅ Temperature Range: -50°C to 220°C ✅ Volume: 2g

HY-P13 Product Page

HY-P13 Thermal Paste Application Guide