100mm x 100mm x 3mm CPU Chip Heatsink Cooling Thermal Conductive Silicone Pad

Description: CPU Chip Heatsink Cooling Thermal Conductive Silicone Pad is designed to improve heat dissipation efficiency in electronic devices. It is made of high-quality silicone material, which is soft, pliable, and has excellent thermal conductivity. This pad is suitable for various applications, including CPUs, GPUs, heat sinks, and other electronic components that require efficient heat dissipation. The pad is easy to install and can be customized to fit different device sizes and shapes. Product Features: - High thermal conductivity ensures efficient heat transfer away from critical components - Soft and pliable silicone material conforms to irregular surfaces, maximizing heat transfer - Easy to install and remove, allowing for quick maintenance and upgrades - Non-toxic and environmentally friendly - Durable and long-lasting, providing reliable performance over an extended period Applications: - CPU and GPU cooling - Heat sink applications - Electronic component heat dissipation - Telecom equipment cooling - Power supply cooling Benefits: - Improved heat dissipation efficiency - Reduced operating temperatures - Enhanced system stability and reliability - Extended component lifespan - Noise level reduction due to lower operating temperatures Specifications: - Material: Silicone - Thermal Conductivity: 1.5W/mK - Thickness: 3mm - Color: Gray - Size: 100mm x 100mm Key Usage Points: - Easy installation with peel-and-stick design - Flexible silicone conforms to uneven surfaces - High thermal conductivity for maximum heat transfer - Wide range of applications, suitable for various electronic devices - Durable construction ensures long-lasting performance Additional Features: - RoHS compliant - UL94 V-0 flame retardant rating - Provides electrical insulation properties

Thermal Interface Materials (TIMs) for Electronics Cooling

Thermal Interface Materials (TIMs): An Overview