High-Performance CX H1300 Thermal Putty for CPU Heatsink – 13.5W/m-K for Optimal Heat Transfer

Boxed CX H1300 Thermal Putty 13.5W / m-K for CPU Heatsink The Boxed CX H1300 Thermal Putty is a high-performance thermal interface material designed to maximize heat transfer between your CPU and heatsink ensuring optimal cooling and system stability. Product Features: Exceptional Thermal Conductivity: With a thermal conductivity of 13.5W / m-K, the thermal putty efficiently transfers heat away from the CPU, ensuring efficient cooling and preventing overheating. Easy and Convenient Application: The putty-like consistency makes it effortless to apply, eliminating the need for precise measurements or spatulas. Simply spread it evenly over the CPU surface for optimal heat transfer. Durable and Reliable: Engineered to withstand high temperatures and prolonged use, the thermal putty maintains its stability and performance over time, providing long-lasting cooling efficiency. Non-Toxic and Non-Corrosive: Safe for use with all CPU types and heatsinks, the thermal putty does not contain any harmful substances and will not damage your components. Versatile Compatibility: Compatible with a wide range of CPU types and heatsinks, the thermal putty ensures effective heat transfer across various systems and configurations. By utilizing the Boxed CX H1300 Thermal Putty, you can enhance the cooling performance of your CPU, ensuring stable operation, extended component life, and optimal system performance. Learn more about Boxed